R&D

We introduce you to the R&D
of SEVENENG, Co., Ltd., a reliable company to entrust.

We are a venture business that develops and manufactures dies and jigs used in cameras/computers/medical equipment. We manufacture our products with highest technologies and select quality.

R&D

SUS automatic tack welding Die (completed in 2016)
Rigid-Flex shearing Die
Jig developed with new materials
Development of technology of after-treatment process of new material jigs.
Technical data sheet

Enhanced the workability and productivity of the FPCB manufacturing process

FPCB magnesium alloy JIG

Characteristics by materials

Material characteristics	Bakelite	Aluminum	Magnesium
Density (density, g/cm3)	~1.8	2.70	1.78
Specific heat capacity (specific heat capacity, J/cm3·K)	0.92	2.42	1.78
Thermal conductivity (thermal conductivity, W/m·K)	0.2	167	96
* Destructive temperature (℃)	120~140	-	-
Melting point (melting temperature, ℃)	-	646	632
Tensile strength (tensile strength, MPa)	~50	310	266

· The temperature at which the material starts carbonization, collapse, and melts

Bakelite Jig 500 x 450
3.78 kg

Al Jig 500 x 450
5.64 kg

Mg Jig 500 x 450
3.72 kg

Weight is the same as that of bakelite Jig and precision and thermal characteristics are superior that those of the aluminium jig.

Development of magnesium alloy jig for manufacture of FPCB.
Development of magnesium alloy jig production for hot press equipment.

Optimization of the after-treatment process of magnesium alloy fabrication.

Currently the development of process condition optimization technology for surface treatment of magnesium alloy jig is under way.

Currently the development of process technology for the after-treatment of magnesium alloy jig is under wat.

TOOL TYPE

Major classification	Sub-classification 1	Sub-classification 2
TOOL	HARD TOOL	PIERCING
		COMPOUND	KNOCK-OUT TYPE
		COMPOUND	PUSH BACK TYPE
	SOFT TOOL	WOOD	Wooden pattern TYPE
		WOOD	PVC(Sealing) TYPE
		PINNACLE
		ROTARY

· Others : TRIM Die, automatic tack welding Die, AUTO Die, Drawing & redrawing Die, Progressive Die, MOLD & CONNECTOR Die.

Die(HARD TOOL)

What is a Die?

A metallic shape made to manufacture products of the same scale in massive volume.

Needs for Die

It gives dimensional precision to products and parts manufactured.
Because of the same dimensions of products made using it, products are compatible and it is easy to assemble the parts.
The appearance of the products are neat and it is easy to change models.
It is possible to produce a product without special technique or skills.
The time for producing a product is reduced.

Kinds of Die

HARD TOOL	PIERCING	Sub-materials(COVERLAY,P.P,BOND...): mainly used for punch out and after fabrication of the routing (punching out), useless parts are sheared and the useful parts the only are left with the product.
	COMPOUND	KNOCK-OUT	Used for routing and is a fabrication method where the product that gets off from the workpiece that was inserted between upper PAD and IDE and was slided vertically is received using a knockout cylinder.
	COMPOUND	PUSH BACK	Used for routing and, different from the knockout operation method, a method of fabrication where the workpiece is inserted into a panel or block again at the same time it is punched out (the inspection of the next operation is easy).

Die structure

rnd_img_structure1

Principles of Die press

First phase : Plastic deformation occurs. Plastic deformation occurs on the product.

Second phase : Penetration phase Deformation of the product(shearing) starts.

Third phase : Failure phase. Failure occurs between the PUNCH and the shearing edge of the DIE.

What is FPCB(FLEXIBLE PRINTED CIRCUITS BOARD)?

An electronic part that was developed to respond to the trends of miniaturization and complexification of electronic parts and which has a good workability, and superior heat-resisting property, bending-resistance, chemical-resistance shows less variability of dimensions, strong at heat, and it takes less time in assembly of products made from it.
This is widely used as a critical parts in such electronic products camera, computer and it peripherals, PRINTER, HANDPHONE, VIDEO & AUDIO device, CAMCORDER, DVD, TFT LCD, satellite devices, military equipment and medical equipment.

Advantages of FPCB

It is possible to three-dimensional wiring without any other support. It is possible to realize minimization and weight-reduction of appliances.
It is possible to wiring with high-durability and high-density upon repeatedly flexed surfaces(0.2m/m pitch)
There is no error in wiring and the assembly operation is easy and highly reliable. Repetitive production mode is possible.

Overview of FPCB

Function	A part of electronic appliance used to mount electronic parts and connect among those parts electrically.
Emergence	Since the US NBS(National Bureau Standard) has used the vacuum tube as an active element and formed an circuit of resisters, condensers and coils connected a printed circuit on the insulated board to minimization of electronic devices in 1947, the current form of PCB has emerged.
Characteristics	· It became the basic parts of all electronic products. · It is a kind of complex set of technologies such as mechanics, electronics, chemicals, metallics, etc. · It is a critical part that leads the development of IT industry. · As it is an equipment industry, it requires precision in timing of investment and scale. · The business is affected by environmental factors such as business cycle of the electronics industry.
Trends	Minimization and high-functionalization of electronics part. → Trends of high-density and multi-layerization of PCB materials / manufacturing process (Substrate/Build-up)

Classification of FPCB

Single-face PCB (Single Side PCB)	· PCB for which the circuit is formed on only one face. · Mounting density is low and manufacturing process is simple. · Used in: Mass production items such home appliance products as TV, VTR, AUDIO, refrigerator.
Dual-face PCB (Double Side PCB)	· PCB for which the circuit are formed on the two faces, upper and lower side. · It is possible to mount parts in higher density compared to single-face PCB. · Used in: low function OA devices such ad PRINTER, FAX and low price industrial devices.
Multi-layer PCB (Multi Layer Board)	· Three-dimensional PCB which has internal and external circuits. · Using three dimensional wiring, it is possible to mount parts in higher density. · Used in: Large computers, PC, communication devices, small home appliances.
Special PCB	① IVH PCB (Interstitial Via Hole PCB) · PCB where partial vial holes are fabricated so that selective circuit connection is possible by layer. · Used in: High function small electronic devices such as obile phone, notebook PC, PDA etc. ② BGA PCB (Ball Grid Array PCB) · PCB for use in a packaged product that is designed to mount the Solder Ball that was attached to the under-side of a sub-board for packaged product on which Bare Chip is mounted. ③ R-F PCB (Rigid-Flex PCB) · For maximum use of limited device space and enhancement of reliability of connection, connect between rigid MLB structures using integrated Flex PCBs.

FPCB manufacturing process (MLB-basis)

01 Cuttiing

Cuts raw materials (Core) into panel sizes suitable for processing.

02 Formation of internal layers

Form circuits on the internal materials(exposure to light, development, corrosion, flaking)

03 Lamination

Conjugate internal raw material in which the circuit is formed and the insulator layer in high temperature.

04 CNC Drill

Hole fabrication for the interconnection between layers.

05 Copper plating

By plating the holes with copper, connect external layer and internal layer.

06 Formation of the external circuit

Form external circuit on the copper plated external layer (exposure to light, development, corrosion, flaking)

07 Printing

Apply inalterable ink for the purpose of circuit protection.

08 Surface treatment

Surface treatment for the prevention of oxidization of the copper plate where ink is not applied.

09 Routing (External shape processing)

Route the panel in sizes that are required by customers.

10 B.B.T

Inspection to find out electrical defects.

11 Final inspection

A total inspection to find out defects in appearance using magnifying glass.

12 Shipment test

Inspect appearance defects/dimension defects through sampling.

13 Packaging

Package the product using vacuum packing and buffer materials.

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